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News

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Conferences

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News Release

 

BroadPak Introduces Semiconductor Industry's First Tamper-Resistant and Security-Enabled 2.5D/3D Packaging Technology

Providing trusted security and resilient platform to meet the emerging market demand for secure enterprise

San Jose, California, July 9, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. CONTINUE

 

Events

BroadPak Corp.BroadPak presents on "Heterogeneous SIP Enabling Deep Learning Applications" at the 1st International Conference and Exhibition on System in Package (SIP) Technology. Sonoma, California, June 27-29, 2017

BroadPak Corp.BroadPak presents on "Application Driven Heterogeneous Fan-Out/2.5D & 3D Integration " at the Advanced Packaging & System Integration Technology Symposium. Wuxi, China, April 20-21, 2017

BroadPak Corp.BroadPak CEO delivers Keynote speech on "Packaging & IOT Security" at the 12th International Conference and Exhibition on Device Packaging. Fountain Hills, Arizona, March 15-17, 2016

BroadPak Corp.BroadPak presents on "Pathfinding and Co-Design Methodology for Fan-Out and 2.5D/3D Integration" at the Advanced Packaging & System Integration Symposium. Wuxi, China, April 21-22, 2016

BroadPak Corp.BroadPak CEO delivers speech on "Packaging Security for the IOT Era" at the Semicon Southeast Asia. SPICE Arena, Penang, Malaysia, April 26-28, 2016

BroadPak Corp.BroadPak presents technical paper "On the Electrical Performance of Rigid Silicon Interposer" at the 18th IEEE International Interconnect Technology Conference. San Jose, California, May 23-26, 2016

 

 

 

2.5D/3D Service Center

 
 
  • State-of-the-art package substrate co-design services and turnkey substrate manufacturing and assembly
  • Total solution to develop and launch 2.5D/3D products
  • Silicon inerposer wafer finish services
  • Silicon interposer manufacturing
  • Interposer architecture, pathfinding, design and integration
  • Industry's first universally configurable silicon interposer
  • Industry's first 2.5D tamper-resistant and security platform
  • 2.5D/3D logic and High Bandwidth Memory (HBM) solution
  • Logic partitioning and pathfinding methodology
  • Monolithic SOC to low power 2.5D/3D conversion
  • Through Silicon Via (TSV) design for stress and reliability
  • Interposer architectural trade off and cost analysis
  • Interposer warpage control design and thermal-stress management
  • I/O ring optimization, bump matrix architecture and hierarchial I/O assignment
  • RDL design based on bump matrix to I/O assignment
  • Comprehensive signal-power and stress integrity
  • Interposer qualification and stress test
  • Assembly and test (through our ecosystem of partners)
  • Dedicated support
 

About BroadPak

 
BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive package design and development services, and innovative total solutions. BroadPak’s mission is to enable and accelerate the development and commercialization of green semiconductor products and IPs.

BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs.

The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients. BroadPak supports global clients in networking, communications, medical, aerospace, defense, and consumer electronics.
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