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News Release

 

BroadPak Introduces Semiconductor Industry's First Universally Configurable 2.5D/3D Silicon Interposer Platform that Simultaneously Develops Prototypes and Production-Ready Solutions

Single Platform Fits All Applications, Eliminates Set-up Time and Tooling Costs, and Cuts Prototype Development Time From 12 Weeks to 10 Days

San Jose, California, January 27, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions used to enable and accelerate the development of 2.5D/3D electronic systems, today announced the immediate availability of semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production. This new technology enables companies to have access to fully customized 2.5D/3D silicon interposer in just 10 days with option of immediate release to high-volume manufacturing. CONTINUE

 

2.5D/3D Integration Services

 
 
  • Total solution to develop and launch 2.5D/3D products
  • Industry's first universally configurable silicon interposer
  • prototype and production-ready interposer in 10 days
  • 2.5D/3D logic and memory solution
  • Logic partitioning and pathfinding methodology
  • Monolithic SOC to low power 2.5D/3D conversion
  • 2.5D/3D Known Good Die (KGD) supply chain management
  • 2.5D/3D architecture, design and integration
  • Through Silicon Via (TSV) design for stress and reliability
  • Interposer architectural trade off and cost analysis
  • Interposer warpage control design and thermal-stress management
  • Interposer I/O ring design, bump matrix architecture
  • Interposer hierarchial I/O assignment
  • I/O cell buffer placement based on interposer loading
  • RDL design based on bump matrix to I/O assignment
  • Comprehensive signal-power and stress integrity
  • Interposer qualification and stress test
  • Assembly and test (through our ecosystem)
  • Dedicated support
 

About BroadPak

 
BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions. BroadPak’s mission is to enable and accelerate the development and commercialization of 2.5D/3D semiconductor products and IPs.

BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs.

The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients. BroadPak supports global clients in networking, communications, medical, aerospace, defense, and consumer electronics.
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