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BroadPak Corp.
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BroadPak Corp.
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News
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the International Symposium on Microelectronics (IMAPS 15)
Orlando, Oct. 27-29, 2015
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the Advanced Semiconductor Technology Conference
Singapore, July 27-28, 2015
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the Custom Integrated Circuit Conference (CICC 2015)
San Jose, Sep. 28-30, 2015
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the Design Automation Conference (DAC 2015)
San Francisco, June 8, 2015
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the European 3D TSV Summit
Grenoble, France, Jan 20, 2015
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology
Guilin, China, October 28, 2014
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the International Symposium on Microelectronics (IMAPS 14)
San Diego, Oct. 13-16, 2014
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the Advanced Packaging and System Integration Technology Symposium
Wuxi, China, August 28, 2014
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the Design Automation Conference (DAC 2014)
San Francisco, June 2, 2014
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the IEEE Electronic Components and Technology Conference
Florida, May 27, 2014
 
BroadPak Corp. BroadPak Presents at the Mentor Graphics User Conference (U2U)
San Jose, April 10, 2014
 
BroadPak Corp. BroadPak Presents at the Design, Automation & Test Conference in Europe
Germany, March 24, 2014
BroadPak Corp.
BroadPak Corp. BroadPak Presents at the IMAPS 10th International Conference and Exhibition on Device Packaging
Arizona, March 11, 2014
BroadPak Corp.
BroadPak Corp. BroadPak CEO Delivers Keynote Speech on 2.5D/3D Technolgies at Symposium on High-Performance and Emerging Technologies
Hong Kong, August 30, 2013
BroadPak Corp.
BroadPak Corp. BroadPak CEO Lectures on 2.5D/3D Silicon Interposer  before The United States Govenment Patent and Trademarks Office (USPTO)
Washington DC, May 14, 2013
 

Conferences
BroadPak Corp.

IMAPS 10th International Conference and Exhibition on Device Packaging
March 11-13, 2014

Design, Automation and Test Conference in Europe
March 24-27, 2014

IEEE Electronic Components and Technology Conference (ECTC)
May 27-30, 2014

GSA Global Leadership Summit 2014
March 20, 2014

DESIGN AUTOMATION CONFERENCE (DAC 2014)
June 1-5, 2014
 
   
   
BroadPak Corp.

News Release
 

BroadPak Introduces Semiconductor Industry's First Tamper-Resistant and Security-Enabled 2.5D/3D Packaging Technology

Providing trusted security and resilient platform to meet the emerging market demand for secure enterprise

San Jose, California, July 9, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. CONTINUE
 

Upcoming Events
BroadPak Corp.BroadPak CEO delivers Keynote speech on "Packaging & IOT Security" at the 12th International Conference and Exhibition on Device Packaging. Fountain Hills, Arizona, March 15-17, 2016

BroadPak Corp.BroadPak presents on "Pathfinding and Co-Design Methodology for Fan-Out and 2.5D/3D Integration" at the Advanced Packaging & System Integration Symposium. Wuxi, China, April 21-22, 2016

BroadPak Corp.BroadPak CEO delivers speech on "Packaging Security for the IOT Era" at the Semicon Southeast Asia. SPICE Arena, Penang, Malaysia, April 26-28, 2016

BroadPak Corp.BroadPak presents technical paper "On the Electrical Performance of Rigid Silicon Interposer" at the 18th IEEE International Interconnect Technology Conference. San Jose, California, May 23-26, 2016

 

 

 

2.5D/3D Integration Services
 
 
  • Total solution to develop and launch 2.5D/3D products
  • Silicon inerposer wafer finish services
  • High volume silicon interposer supply
  • Industry's first universally configurable silicon interposer
  • Industry's first 2.5D tamper-resistant and security platform
  • 2.5D/3D logic and High Bandwidth Memory (HBM) solution
  • Logic partitioning and pathfinding methodology
  • Monolithic SOC to low power 2.5D/3D conversion
  • Known Good Die (KGD) supply chain management
  • 2.5D/3D architecture, design and integration
  • Through Silicon Via (TSV) design for stress and reliability
  • Interposer architectural trade off and cost analysis
  • Interposer warpage control design and thermal-stress management
  • I/O ring design, bump matrix architecture and hierarchial I/O assignment
  • I/O cell placement optimization in the context of system
  • RDL design based on bump matrix to I/O assignment
  • Comprehensive signal-power and stress integrity
  • Interposer qualification and stress test
  • Assembly and test (through our ecosystem)
  • Dedicated support
 

About BroadPak
 
BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions. BroadPak’s mission is to enable and accelerate the development and commercialization of green semiconductor products and IPs.

BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs.

The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients. BroadPak supports global clients in networking, communications, medical, aerospace, defense, and consumer electronics.
BroadPak Corp.




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BroadPak Corp.
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