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BroadPak a premier provider of semiconductor package substrate design and development services introduces a revolutionary design methodology for packaging the emerging 40nm node. With its core expertise in advanced high performance substrate design and test, BroadPak is the only independent substrate design center dedicated to silicon-package co-design methodology for demanding applications where cost reduction and increase in performance matters.

Through unique miniaturization techniques BroadPak provides unprecedented level of miniaturization for system in package (SIP) used in very low profile (VLP) applications.