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News Release

 

BroadPak Introduces Semiconductor Industry's First Tamper-Resistant and Security-Enabled 2.5D/3D Packaging Technology

Providing trusted security and resilient platform to meet the emerging market demand for secure enterprise

San Jose, California, July 9, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products. CONTINUE

 

2.5D/3D Integration Services

 
 
  • Total solution to develop and launch 2.5D/3D products
  • Industry's first universally configurable silicon interposer
  • Industry's first 2.5D tamper-resistant and security platform
  • prototype and production-ready interposer in 10 days
  • 2.5D/3D logic and memory solution
  • Logic partitioning and pathfinding methodology
  • Monolithic SOC to low power 2.5D/3D conversion
  • Known Good Die (KGD) supply chain management
  • 2.5D/3D architecture, design and integration
  • Through Silicon Via (TSV) design for stress and reliability
  • Interposer architectural trade off and cost analysis
  • Interposer warpage control design and thermal-stress management
  • I/O ring design, bump matrix architecture and hierarchial I/O assignment
  • I/O cell placement optimization in the context of system
  • RDL design based on bump matrix to I/O assignment
  • Comprehensive signal-power and stress integrity
  • Interposer qualification and stress test
  • Assembly and test (through our ecosystem)
  • Dedicated support
 

About BroadPak

 
BroadPak is the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions. BroadPak’s mission is to enable and accelerate the development and commercialization of green semiconductor products and IPs.

BroadPak offers cost-effective ultra-high performance 2.5D/3D integration and supply chain ecosystem for mixed process Known Good Die (KGD) and high performance IPs.

The company leverages its industry-leading world-class expertise and proven packaging technologies to create competitive advantage for its clients. BroadPak supports global clients in networking, communications, medical, aerospace, defense, and consumer electronics.
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