BroadPak is the industry leader in advanced semiconductor package substrate design and signal integrity services. BroadPak is known to be the only independent substrate design center dedicated to silicon-package-board co-design methodology and guarantees to deliver lowest cost  ultra high performance substrate with first pass success.

Over the years BroadPak has architected and delivered some of the most advanced ultra high performance substrates in the industry for many of the leading companies, including 3D silicon/glass interposer (TSV, TGV), DDRII-DDRIII package on package, 3D wafer level stacking, mixed IP die stacking, system in package SIP, 10G/40G/100G high speed Ethernet PHY/SerDes, high frequency parallel interfaces, etc. BroadPak provides comprehensive dedicated support in 3D packaging solution such as silicon/glass interposer and Through Silicon/Glass Via (TSV, TGV) for mixed process nodes and IPs.