BroadPak a premier provider
of semiconductor package substrate design and development services
introduces a revolutionary design methodology for packaging the
emerging 40nm node. With its core expertise in advanced high
performance substrate design and test, BroadPak is the only independent substrate design center
dedicated to silicon-package co-design
methodology for demanding applications where cost reduction and
increase in performance matters.
Through unique miniaturization techniques
BroadPak provides unprecedented level of miniaturization for system
in package (SIP) used in very low profile (VLP) applications.