As a leading provider of ultra-high performance 2.5D
silicon interposer and 3D integration technologies,
BroadPak provides cost effective packaging solutions to
clients varying from networking, communication, medical,
aerospace, defense and consumer electronics. BroadPak
brings proven methodologies and expertise to provide a
competitive edge to the customers.
Over the years BroadPak has architected and delivered
some of the most advanced ultra high performance
substrates in the industry for many of the leading
companies, including memory stacking, 3D wafer level
stacking, mixed IP die stacking, system in package
(SIP), 10G/40G/100G high speed Ethernet PHY/SerDes and
high frequency parallel interfaces.
comprehensive dedicated 2.5D/3D silicon interposer
design, integration and supply chain management for
mixed process nodes and IPs.