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BroadPak is a premier provider of semiconductor package substrate design and test services. Over the years BroadPak has designed and delivered some of the most advanced high performance substrates in the industry for many of the leading companies.

With process nodes shrinking, substrate performance is the most critical path to successful product deployment. At these nodes package becomes an integral part of the silicon design and silicon-package must be designed as one unit.

Package related design areas such as Electrical, Mechanical, Material and Assembly are equally and significantly critical at lower process nodes. BroadPak business model is uniquely architected from ground up to address these issues for a successful tape out, smallest die size, lowest package cost and accelerated time to market.