signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP

BroadPak mission is to:

Provide advanced substrate design services for sensitive process nodes.
Support start-ups with prototype to low volume as well as subsequent mid to high volume production.
Bring dedicated silicon-package co-design capability within the organizations and help reduce cost.
Provide a cost effective packaging and operation outsourcing solution to accelerate time to market .