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Foundation of Packaging
Substrate is the foundation of
semiconductor packaging. Substrate design manifests the foremost
critical factor in chip and system performance. Over the years BroadPak has
designed and delivered some of the most advanced and complex high
performance substrates in the industry for many of the leading
companies.
With process nodes shrinking, substrate design and performance
has become the most critical factor for successful product deployment. At
these nodes substrate design becomes an integral part of the
silicon design process and silicon-substrate must be designed
concurrently as
one unit. BroadPak's substrate design process is architected
from ground-up for co-design.
At BroadPak
substrates are architected with strict adherence to the
principals of signal integrity, electromagnetic fundamentals,
design for manufacturing (DFM) yield and cost.
Substrates are designed for wide variety of packaging solutions
including:
-- Flip Chip
-- 3D Wafer Level Packaging
-- Cavity Down and Up
-- System in Package (SIP)
-- 3D packaging, Package on Package (POP)
Substrate Cost
Substrate cost is a significant part of the overall product cost
and literally all parameters such as substrate size, core
structure, layer count, drill count and design rule influence the end cost.
Substrate material is also directly tied to the end cost.
Substrate materials for Integrated Circuits packages include
rigid organic laminate, organic build-up, ceramic and flex
circuit materials. Demand for organic build-up substrates for
flip chip is dominated by cost verses performance for high
performance devices such as microprocessors, FPGA's, ASIC's,
DSP's, Graphics, Chip sets and the future growth in wireless
products.
BroadPak substrate design process is guaranteed to be
optimized for cost verses performance.
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 Redistributed
(RDL) flip chip on a build-up substrate
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