signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP

	Reliability and Quality No product will ever make it to the real world without passing the Reliability and Quality Standards. That is why reliability and quality is the corner stone of BroadPak. Product failure due to reliability and quality are costly and a major cause of product delay. At BroadPak substrates are designed with strict adherence to the foundation of reliability and quality standards. Substrates are further simulated to investigate any deviation from reliability and quality standards. Reliability analysis/modeling -- New package qualification -- Substrate reliability -- Warpage, die-package cracking -- Solder joint reliability (i.e. lead-free material) -- Drop test and structural reliability -- Hermaticity -- Fatigue and product life-time -- Package and Chip on board reliability -- Material characterization, interfacial delamination and popcorning -- Failure analysis