BroadPak is a premier provider of semiconductor package
substrate design and signal integrity services,
providing packaging solutions to clients varying from
networking, communication, consumer electronics and
semiconductor industries. BroadPak brings proven
methodologies and expertise to provide a competitive
edge to the customers.
BroadPak was founded in 2006 by a group of packaging and
test professionals with in-depth knowledge and
experience in their respective fields. Today BroadPak is
recognized as a leading provider of low cost ultra high
performance substrate design and 3D solution provider.
