SOI Ecosystem Expands to Include Advanced
Packaging Development
Boston, MASS., May 6, 2010 – The
SOI Industry
Consortium, aimed at accelerating
silicon-on-insulator (SOI) innovation across broad
markets, announced today that
BroadPak has
joined the worldwide organization.
BroadPak is a premier provider of semiconductor package
design and development services. The addition of
BroadPak, with its unique silicon-package co-design
methodology, expands opportunities for SOI chip
developers to reduce product cost and improve chip and
system performance without impacting chip development
schedules.
“BroadPak brings its expertise in advanced
high-performance, high pin-count package design and test
to the SOI community,” said Farhang Yazdani, president
and chief technical officer of Broadpack. “We look
forward to collaborative relationships with other
members of the SOI Industry Consortium to meet the
demands of the highly integrated, high performance and
low voltage systems that are made possible with SOI.”
“We are extremely pleased to have BroadPak join us,
”said Horacio Mendez, executive director of the SOI
Industry Consortium. “As a leading supplier of advanced
packaging design services, BroadPak brings valuable and
complementary expertise to our ecosystem of companies
and assembly-level enablement in this time of SOI market
acceleration.”
