Reliability & Qualification

Package Reliability

Product failure due to reliability and quality are costly and a major cause of product delay. At BroadPak substrates are designed with strict adherence to the foundation of reliability and quality standards. Substrates are further simulated to investigate any deviation from reliability and quality standards.

Reliability analysis/modeling

---  New package qualification
---  Substrate reliability
---  Warpage, die-package cracking
---  Solder joint reliability (i.e. lead-free material)
---  Drop test and structural reliability
---  Hermaticity
---  Fatigue and product life-time
---  Package and Chip on board reliability
---  Material characterization, interfacial delamination and popcorning